293 citations · 1.4k across the 68 of their papers we have counts for
7 papers · 1 filter
Plasma sheath tailoring by a magnetic field for three-dimensional plasma etching
E. Jüngling, S. Wilczek, T. Mussenbrock +2
Three-dimensional (3D) etching of materials by plasmas is an ultimate challenge in microstructuring applications. A method is proposed to reach a controllable 3D structure by using…
Interactions between flow fields induced by surface dielectric barrier discharge arrays
Alexander Böddecker, Maximilian Passmann, Sebastian Wilczek +6
This study investigates the flow field induced by a surface dielectric barrier discharge (SDBD) system, known for its efficient pollution remediation of volatile organic compounds…
PECVD and PEALD on polymer substrates (Part II): Understanding and tuning of barrier and membrane properties of thin films
Teresa de los Arcos, Peter Awakowicz, Marc Böke +19
This feature article presents insights concerning the correlation of PECVD and PEALD thin film structures with their barrier or membrane properties. While in principle similar prec…
PECVD and PEALD on polymer substrates (part I): Fundamentals and analysis of plasma activation and thin film growth
Teresa de los Arcos, Peter Awakowicz, Jan Benedikt +17
This feature article considers the analysis of the initial states of film growth on polymer substrates. The assembled results are based on the cooperation between research groups i…
Nonlocal dynamics of secondary electrons in capacitively coupled radio frequency discharges
Katharina Noesges, Maximilian Klich, Aranka Derzsi +5
In capacitively coupled radio frequency (CCRF) discharges, the interaction of the plasma and the surface boundaries is linked to a variety of highly relevant phenomena for technolo…
Generation of energetic electrons by surface waves in VHF CCPs
D. Eremin, E. Kemaneci, M. Matsukuma +3
Capacitively coupled plasmas (CCP) comprise one of the main tool in active use in the plasma processing industry. However, increasing the driving frequency and electrode size is li…