David S. Catherall

activity

20242026

collaborators

3 papers

cond-mat.mtrl-sci2026

Characterization of ultrathin nickel films deposited by thermal laser evaporation

David S. Catherall, Yifei Yan, Finley B. Donachie +2

Thermal laser evaporation is a physical vapor deposition technique of increasing interest because of its ability to evaporate essentially any solid element, even the most refractor…

cond-mat.mtrl-sci2025

Atomic layer etching of niobium nitride using sequential exposures of O $_{2}$ and H $_{2}$ /SF $_{6}$ plasmas

Azmain A. Hossain, Sela Murphy, David S. Catherall +2

Niobium nitride (NbN) is a metallic superconductor that is widely used for superconducting electronics due to its high transition temperature ( $T_{c}$ ) and kinetic inductance. Proces…

physics.app-ph2024

Atomic layer etching of SiO $_{2}$ using sequential exposures of Al(CH $_{3}$ ) $_{3}$ and H $_{2}$ /SF $_{6}$ plasma

David Catherall, Azmain Hossain, Austin Minnich

On-chip photonic devices based on SiO $_{2}$ are of interest for applications such as microresonator gyroscopes and microwave sources. Although SiO $_{2}$ microdisk resonators have achie…

Characterization of ultrathin nickel films deposited by thermal laser evaporation

Atomic layer etching of niobium nitride using sequential exposures of O2​ and H2​/SF6​ plasmas

Atomic layer etching of SiO2​ using sequential exposures of Al(CH3​)3​ and H2​/SF6​ plasma

Atomic layer etching of niobium nitride using sequential exposures of O $_{2}$ and H $_{2}$ /SF $_{6}$ plasmas

Atomic layer etching of SiO $_{2}$ using sequential exposures of Al(CH $_{3}$ ) $_{3}$ and H $_{2}$ /SF $_{6}$ plasma