7 papers
Predictive Structure to Thermal Conductivity Modeling Framework for BEOL Interconnect Stacks in Advanced Technology Nodes Enabled by Extensive Layer Resolved Thermal Measurements
Zifeng Huang, Yiyang Sun, Tianyu Jia +2
The increasing structural complexity of BEOL interconnect stacks in advanced integrated circuits demands a structure-aware thermal conductivity (\k{appa}) modeling framework. Howev…
Unveiling the Scaling Potential of Drain Merge through Active (DMtA) in CFETs: Breaking the Super-Via Bottlenecks and Unlocking New PPA Boosters
Jingru Jiang, Haoran Lu, Kairong Guo +11
Drain merge (DM), a super via vertically connecting the common S/D terminals of stacked n/pFETs in Complementary FETs (CFETs), blocks further parasitic optimization and cell scalin…
A Novel Decoupling Method for Investigating Distinct Domain Evolution in Ferroelectric Film
Keying Sun, Jiajun Qiu, Hao Li +5
Conventional polarization characterization techniques provide only the averaged response of ferroelectric films, limiting the investigation of domain-dependent reliability mechanis…
High Thermal Conductivity of Back-End-of-Line Compatible Diamond Films
Jinwen Liu, Chufei Cheng, Feifei Tan +6
Back-end-of-line (BEOL) thermal management requires electrically insulating heat-spreading dielectric that can be integrated within thermal budgets below 400 C. Here, we report pol…
Experimental Observation of Extremely Strong Defect-Phonon Scatterings in Semiconductor Single Crystals
Zifeng Huang, Jianbo Liang, Yuxiang Wang +5
The role of doping in tailoring thermal transport in semiconductors is critical for efficient thermal management in electronic devices. While the effects of doping have been extens…
Design Optimization of Flip FET Standard Cells with Dual-sided Pins for Ultimate Scaling
Rui Gui, Haoran Lu, Jiacheng Sun +7
Recently, we proposed a novel transistor architecture for 3D stacked FETs called Flip FET (FFET), featuring N/P transistors back-to-back stacked and dual-sided interconnects. With…
A Systematic Approach for Multi-objective Double-side Clock Tree Synthesis
Xun Jiang, Haoran Lu, Yuxuan Zhao +8
As the scaling of semiconductor devices nears its limits, utilizing the back-side space of silicon has emerged as a new trend for future integrated circuits. With intense interest,…