23 citations · 34 across the 3 of their papers we have counts for
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Microsecond non-melt UV laser annealing for future 3D-stacked CMOS
Toshiyuki Tabata, Fabien Rozé, Louis Thuries +8
Three-dimensional (3D) CMOS technology encourages the use of UV laser annealing (UV-LA) because the shallow absorption of UV light into materials and the process timescale typicall…
Solid Phase Recrystallization in Arsenic Ion-Implanted Silicon-On-Insulator by Microsecond UV Laser Annealing
Toshiyuki Tabata, Fabien Rozé, Pablo Acosta Alba +5
UV laser annealing (UV-LA) enables surface-localized high-temperature thermal processing to form abrupt junctions in emerging monolithically stacked devices, where the applicable t…
Laser Processing For 3D Junctionless Transistor Fabrication
D. Bosch, P. Acosta Alba, S. Kerdiles +13
To take fully advantage of Junctionless transistor (JLT) low-cost and low-temperature features we investigate a 475 degC process to create onto a wafer a thin poly-Si layer on insu…