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20192022
most citedGate Leakage Suppression and Breakdown Voltage Enhancement in p-GaN HEMTs using Metal/Graphene Gates

50 citations · 91 across the 10 of their papers we have counts for

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physics.app-ph2019★ 50 cited

Gate Leakage Suppression and Breakdown Voltage Enhancement in p-GaN HEMTs using Metal/Graphene Gates

Guangnan Zhou, Zeyu Wan, Gaiying Yang +5

In this work, single-layer intrinsic and fluorinated graphene were investigated as gate insertion layers in normally-OFF p-GaN gate HEMTs, which wraps around the bottom of the gate…

physics.app-ph2019

A Method to Determine Broadband Complex Permittivity of Thin Film Dielectric Materials up to 60 GHz

Liang Wang, Guangrui, Xia +1

This paper describes a method to determine the complex permittivity of a thin dielectric film from finite element analysis and microstrip line measurements. Two transmission line e…

physics.app-ph2019★ 2 cited

Threshold Voltage Improvement and Leakage Reduction of AlGaN/GaN HEMTs Using Dual-Layer SiNx Stressors

Wei-Chih Cheng, Minghao He, Siqi Lei +9

In this work, AlGaN/GaN HEMTs with dual-layer SiNx stressors (composed of a low-stress layer and a high-stress layer) were investigated. The low-stress padding layer solved the sur…

physics.app-ph2019

Oxygen-based digital etching of AlGaN/GaN structures with AlN as etch-stop layers

Jingyi Wu, Siqi Lei, Wei-Chih Cheng +5

O2-plamsa-based digital etching of Al0.25Ga0.75N with a 0.8 nm AlN spacer on GaN was investigated. At 40 W RF bias power and 40 sccm oxygen flow, the etch depth of Al0.25Ga0.75N wa…

physics.app-ph2019★ 2 cited

Achieving sub-1 Ohm-mm Non-Recess S/D Contact Resistance in GaN HEMTs Utilizing Simple CMOS Compatible La/Ti/Al/Ti Metal Contacts

Xinpeng Lin, Yumeng Zhu, Yongle Qi +10

In this paper, we report the use of lanthanum (La) in S/D contacts of GaN HEMTs, achieving 0.97 Ohm-mm contact resistance without S/D recess. The HEMTs show well-behaved electrical…