568 citations · 847 across the 21 of their papers we have counts for
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Beam-test evaluation of pre-production Low Gain Avalanche Detectors for the ATLAS High Granularity Timing Detector
A. Aboulhorma, M. Ait Tamlihat, H. M. Alfanda +223
The High Granularity Timing Detector (HGTD) will be installed in the ATLAS experiment as part of the Phase-II upgrade for the High Luminosity-Large Hadron Collider (HL-LHC). It wil…
Thermal Cycling Reliability of Hybrid Pixel Sensor Modules for The ATLAS High Granularity Timing Detector
Y. Li, A. Aboulhorma, M. Ait Tamlihat +219
The reliability of bump connection structures has become a critical aspect of future silicon detectors for particle physics. The High Granularity Timing Detector (HGTD) for the ATL…
Beam test results of IHEP-NDL Low Gain Avalanche Detectors(LGAD)
S. Xiao, S. Alderweireldt, S. Ali +96
To meet the timing resolution requirement of up-coming High Luminosity LHC (HL-LHC), a new detector based on the Low-Gain Avalanche Detector(LGAD), High-Granularity Timing Detector…
Performance of Irradiated RD53A 3D Pixel Sensors
S. Terzo, M. Chmeissani, G. Giannini +5
The ATLAS experiment at the LHC will replace its current inner tracker system for the HL-LHC era. 3D silicon pixel sensors are being considered as radiation-hard candidates for the…
Characterisation of AMS H35 HV-CMOS monolithic active pixel sensor prototypes for HEP applications
S. Terzo, M. Benoit, E. Cavallaro +9
Monolithic active pixel sensors produced in High Voltage CMOS (HV-CMOS) technology are being considered for High Energy Physics applications due to the ease of production and the r…
Radiation hardness of small-pitch 3D pixel sensors up to a fluence of n/cm
J. Lange, G. Giannini, S. Grinstein +5
Small-pitch 3D silicon pixel detectors have been investigated as radiation-hard candidates for the innermost layers of the HL-LHC pixel detector upgrades. Prototype 3D sensors with…
Production and Integration of the ATLAS Insertable B-Layer
B. Abbott, J. Albert, F. Alberti +373
During the shutdown of the CERN Large Hadron Collider in 2013-2014, an additional pixel layer was installed between the existing Pixel detector of the ATLAS experiment and a new, s…
Test beam measurement of ams H35 HV-CMOS capacitively coupled pixel sensor prototypes with high-resistivity substrate
M. Benoit, S. Braccini, R. Casanova +34
In the context of the studies of the ATLAS High Luminosity LHC programme, radiation tolerant pixel detectors in CMOS technologies are investigated. To evaluate the effects of subst…
Radiation hardness of small-pitch 3D pixel sensors up to HL-LHC fluences
J. Lange, S. Grinstein, M. Manna +4
A new generation of 3D silicon pixel detectors with a small pixel size of 5050 and 25100 m is being developed for the HL-LHC tracker upgrades. The radiatio…
Characterisation of novel prototypes of monolithic HV-CMOS pixel detectors for high energy physics experiments
Stefano Terzo, Emanuele Cavallaro, Raimon Casanova +8
An upgrade of the ATLAS experiment for the High Luminosity phase of LHC is planned for 2024 and foresees the replacement of the present Inner Detector (ID) with a new Inner Tracker…
3D silicon pixel detectors for the High-Luminosity LHC
J. Lange, M. Carulla Areste, E. Cavallaro +8
3D silicon pixel detectors have been investigated as radiation-hard candidates for the innermost layers of the HL-LHC upgrade of the ATLAS pixel detector. 3D detectors are already…
Studies of irradiated AMS H35 CMOS detectors for the ATLAS tracker upgrade
Emanuele Cavallaro, Raimon Casanova, Fabian Förster +6
Silicon detectors based on the HV-CMOS technology are being investigated as possible candidate for the outer layers of the ATLAS pixel detector for the High Luminosity LHC. In this…
3D sensors for the HL-LHC
D. Vázquez Furelos, M. Carulla, E. Cavallaro +8
In order to increase its discovery potential, the Large Hadron Collider (LHC) accelerator will be upgraded in the next decade. The high luminosity LHC (HL-LHC) period demands new s…
Development of n-in-p pixel modules for the ATLAS Upgrade at HL-LHC
Anna Macchiolo, Richard Nisius, Natascha Savic +1
Thin planar pixel modules are promising candidates to instrument the inner layers of the new ATLAS pixel detector for HL-LHC, thanks to the reduced contribution to the material bud…
Thin n-in-p planar pixel modules for the ATLAS upgrade at HL-LHC
N. Savic, L. Bergbreiter, J. Breuer +4
The ATLAS experiment will undergo a major upgrade of the tracker system in view of the high luminosity phase of the LHC (HL-LHC) foreseen to start around 2025. Thin planar pixel mo…
Thin n-in-p planar pixel sensors and active edge sensors for the ATLAS upgrade at HL-LHC
S. Terzo, A. Macchiolo, R. Nisius +1
Silicon pixel modules employing n-in-p planar sensors with an active thickness of 200 m, produced at CiS, and 100-200 m thin active/slim edge sensor devices, produced at VTT…
Heavily Irradiated N-in-p Thin Planar Pixel Sensors with and without Active Edges
S. Terzo, L. Andricek, A. Macchiolo +4
We present the results of the characterization of silicon pixel modules employing n-in-p planar sensors with an active thickness of 150 m, produced at MPP/HLL, and 100-20…
Development of active edge pixel sensors and four-side buttable modules using vertical integration technologies
A. Macchiolo, L. Andricek, H. -G. Moser +4
We present an R&D activity focused on the development of novel modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The modules consist of n-in-p…
Thin n-in-p pixel sensors and the SLID-ICV vertical integration technology for the ATLAS upgrade at the HL-LHC
A. Macchiolo, L. Andricek, M. Ellenburg +5
The R&D activity presented is focused on the development of new modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The performance after irradia…
The design and commissioning of the MICE upstream time-of-flight system
R. Bertoni, A. Blondel, M. Bonesini +9
In the MICE experiment at RAL the upstream time-of-flight detectors are used for particle identification in the incoming muon beam, for the experiment trigger and for a precise tim…