Nanoscale Field-Effect Transistors: An Ultimate Size Analysis
arXiv:cond-mat/9706026 · doi:10.1063/1.120473
Abstract
We have used a simple, analytically solvable model to analyze the characteristic s of dual-gate metal-oxide-semiconductor field-effect transistors (MOSFETs) with 10-nm-scale channel length L. The model assumes ballistic dynamics of 2D electrons in an undoped channel between highly doped source and drain. When applied to silicon n-MOSFETs, calculations show that the voltage gain (necessary for logic applications) drops sharply at L ~ 10 nm, while the conductance modulation remains sufficient for memory applications until L ~ 4 nm.
An erroneous number in estimates corrected, and paper shortened to fit APL size requirements
Cited by in corpus (11)
- Two Dimensional Quantum Mechanical Modeling of Nanotransistors
- Role of scattering in nanotransistors
- Metallic and semi-metallic <100> silicon nanowires
- Current-Voltage Characteristics of Long-Channel Nanobundle Thin-Film Transistors: A Bottom-up Perspective
- A Thermodynamic Perspective of Negative-capacitance Field-effect-transistors
- Shot noise suppression in multimode ballistic Fermi conductors
- Quantum kinetic description of Coulomb effects in one-dimensional nano-transistors
- Suppression of non-Poissonian shot noise by Coulomb correlations in ballistic conductors
- Shrinking limits of silicon MOSFET's: Numerical study of 10-nm-scale devices
- Analytical device model for graphene bilayer field-effect transistors using weak nonlocality approximation
- Modeling a Schottky-barrier carbon nanotube field-effect transistor with ferromagnetic contacts