Weak Localization Thickness Measurements of Si:P Delta-Layers
arXiv:cond-mat/0408193 · doi:10.1063/1.1842366
Abstract
We report on our results for the characterization of Si:P delta-layers grown by low temperature molecular beam epitaxy. Our data shows that the effective thickness of a delta-layer can be obtained through a weak localization analysis of electrical transport measurements performed in perpendicular and parallel magnetic fields. An estimate of the diffusivity of phosphorous in silicon is obtained by applying this method to several samples annealed at 850 Celsius for intervals of zero to 15 minutes. With further refinements, this may prove to be the most precise method of measuring delta-layer widths developed to date, including that of Secondary Ion Mass Spectrometry analysis.
References in corpus (3)
Cited by in corpus (7)
- Rippled Graphene in an In-Plane Magnetic Field: Effects of a Random Vector Potential
- Bottom-up assembly of metallic germanium
- Atomic-layer doping of SiGe heterostructures for atomic-precision donor devices
- Momentum-space imaging of ultra-thin electron liquids in delta-doped silicon
- 2D-3D crossover in a dense electron liquid in silicon
- Non-destructive X-ray imaging of patterned delta-layer devices in silicon
- Direct integration of atomic precision advanced manufacturing into middle-of-line silicon fabrication