Growth of Ultrathin BiSe Films by Molecular Beam Epitaxy
arXiv:2208.14330 · doi:10.1116/6.0002299
Abstract
BiSe is a widely studied 3D topological insulator having potential applications in optics, electronics, and spintronics. When the thickness of these films decrease to less than approximately 6 nm, the top and bottom surface states couple, resulting in the opening of a small gap at the Dirac point. In the 2D limit, BiSe may exhibit quantum spin Hall states. However, growing coalesced ultra-thin BiSe films with a controllable thickness and typical triangular domain morphology in the few nanometer range is challenging. Here, we explore the growth of BiSe films having thickness down to 4 nm on sapphire substrates using molecular beam epitaxy that were then characterized with Hall measurements, atomic force microscopy, and Raman imaging. We find that substrate pre-treatment -- growing and decomposing a few layers of \BiSe before the actual deposition -- is critical to obtaining a completely coalesced film. In addition, higher growth rates and lower substrate temperatures led to improvement in surface roughness, in contrast to what is observed for conventional epitaxy. Overall, coalesced ultra-thin BiSe films with lower surface roughness enables thickness-dependent studies across the transition from a 3D-topological insulator to one with gapped surface states in the 2D regime.
References in corpus (5)
- Discovery (theoretical prediction and experimental observation) of a large-gap topological-insulator class with spin-polarized single-Dirac-cone on the surface
- Epitaxial growth of topological insulator Bi2Se3 film on Si(111) with atomically sharp interface
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