Low-temperature thermal expansion of the topological material candidates -PtBi and -BiPd
arXiv:2204.02327 · doi:10.1016/j.physb.2022.414102
Abstract
We report on the low-temperature ( 120 K) thermal expansion of the bismuth-based topological semimetal -PtBi and topological superconductor -BiPd candidates. The linear thermal-expansion coefficient of tetragonal -BiPd shows a pronounced anisotropy between the - and -axis while the volume thermal-expansion coefficient (-BiPd) is considerable larger than (-PtBi). The coefficient (-PtBi) nearly matches the experimental specific heat, from which a Debye temperature 199 K is obtained. On the other hand, (-BiPd) reasonably fits the Debye model with 138 K, extracted from the low-temperature specific heat. An almost constant Grüneisen parameter 2 is obtained for both compounds. No magnetostriction is observed in any of both compounds up to 16 T. We compare our results with other Bi-based topological materials.
7 pages, 3 figures
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