Novel Two-Dimensional Layered MSiN (M = Mo, W): New Promising Thermal Management Materials
arXiv:2108.03671 · doi:10.1039/D1CP03941E
Abstract
With the miniaturization and integration of nanoelectronic devices, efficient heat removal becomes a key factor affecting the reliable operation of the nanoelectronic device. With the high intrinsic thermal conductivity, good mechanical flexibility, and precisely controlled growth, two-dimensional (2D) materials are widely accepted as ideal candidates for thermal management materials. In this work, by solving the phonon Boltzmann transport equation (BTE) based on first-principles calculations, we comprehensively investigated the thermal conductivity of novel 2D layered MSiN (M = Mo, W). Our results point to competitive thermal conductivities (162 W/mK) of monolayer MoSiN, which is around two times larger than that of WSiN and seven times larger than that of silicene despite their similar non-planar structures. It is revealed that the high thermal conductivity arises mainly from its large group velocity and low anharmonicity. Our result suggests that MoSiN could be a potential candidate for 2D thermal management materials.
References in corpus (8)
- Graphene field-effect-transistors with high on/off current ratio and large transport band gap at room temperature
- Exceptional piezoelectricity, high thermal conductivity and stiffness and promising photocatalysis in two-dimensional MoSi2N4 family confirmed by first-principles
- Structure-driven intercalated architecture of septuple-atomic-layer family with diverse properties from semiconductor to topological insulator to Ising superconductor
- Valley-dependent properties of monolayer MoSiN, WSiN and MoSiAs
- High Performance Field-Effect Transistor Based on Multilayer Tungsten Disulfide
- Valley pseudospin in monolayer MoSi2N4 and MoSi2As4
- High intrinsic lattice thermal conductivity in monolayer MoSiN
- Intrinsic piezoelectricity in monolayer (X=Ti, Zr, Hf, Cr, Mo and W)