Thermoelectric cooling properties of a quantum Hall Corbino device

Abstract

We analyze the thermoelectric cooling properties of a Corbino device in the quantum Hall regime on the basis of experimental data of electrical conductance. We focus on the cooling power and the coefficient of performance within and beyond linear response. Thermovoltage measurements in this device reported in {\em Phys. Rev. Applied, {\bf 14} 034019 (2020)} indicated that the transport takes place in the diffusive regime, without signatures of effects due to the electron-phonon interaction in a wide range of temperatures and filling factors. In this regime, the heat and charge currents by electrons can be described by a single transmission function. We infer this function from experimental data of conductance measurements and we calculate the cooling power and the coefficient of performance for a wide range of filling factors and temperatures, as functions of the thermal and electrical biases. We predict an interesting cooling performance in several parameter regimes.

10 pages, 8 figures

References in corpus (13)

• Non-Abelian Anyons and Topological Quantum Computation
• Finding the quantum thermoelectric with maximal efficiency and minimal entropy production at given power output
• Chiral thermoelectrics with quantum Hall edge states
• Thermoelectric conversion at 30K in InAs/InP nanowire quantum dots
• Enhanced performance of joint cooling and energy production
• Thermoelectricity near Anderson localization transitions
• Nonlinear spin-thermoelectric transport in two-dimensional topological insulators
• Thermopower of Quantum Hall States in Corbino Geometry as a Measure of Quasiparticle Entropy
• Spin-dependent thermoelectric transport in HgTe/CdTe quantum wells
• Thermoelectrics of Interacting Nanosystems -- Exploiting Superselection instead of Time-Reversal Symmetry
• Nonlinear chiral refrigerators
• Landau Cooling in Metal-Semiconductor Nanostructures
• Diffusion Thermopower of Quantum Hall States Measured in Corbino Geometry