Thermal conduction across a boron nitride and silicon oxide interface

Abstract

The needs for efficient heat removal and superior thermal conduction in nano/micro devices have triggered tremendous studies in low-dimensional materials with high thermal conductivity. Hexagonal boron nitride (h-BN) is believed to be one of the candidates for thermal management and heat dissipation due to its novel physical properties, i.e. thermal conductor and electrical insulator. Here we reported interfacial thermal resistance between few-layer h-BN and its silicon oxide substrate using differential 3 omega method. The measured interfacial thermal resistance is around ~1.6*10-8 m2K/W for monolayer h-BN and ~3.4*10-8 m2K/W for 12.8nm-thick h-BN in metal/h-BN/SiO2 interfaces. Our results suggest that the voids and gaps between substrate and thick h-BN flakes limit the interfacial thermal conduction. This work provides a deeper understanding of utilizing h-BN flake as lateral heat spreader in electronic and optoelectronic nano/micro devices with further miniaturization and integration.

arXiv comment9 pages, 6 figures

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• Resonant supercollisions and electron-phonon heat transfer in graphene
• Probing the ideal limit of interfacial thermal conductance in two-dimensional van der Waals heterostructures
• Thermal boundary conductance and phonon transmission in hexagonal boron nitride/graphene heterostructures
• Heating of inhomogeneous electron flow in the hydrodynamic regime