Improved topological conformity enhances heat conduction across metal contacts on transferred graphene
arXiv:1511.08320 · doi:10.1016/j.carbon.2016.04.005
Abstract
Thermal conductance of metal contacts on transferred graphene (trG) could be significantly reduced from the intrinsic value of similar contacts on as-grown graphene (grG), due to additional resistance by increased roughness, residues, oxides and voids. In this paper, we compare the thermal conductance (G) of Al/trG/Cu interfaces with that of Al/grG/Cu interfaces to understand heat transfer across metal contacts on transferred graphene. Our samples are polycrystalline graphene grown on Cu foils by chemical vapor deposition (CVD) and CVD-grown graphene transferred to evaporated Cu thin films. We find that for the Al/grG/Cu interfaces of as-grown CVD graphene, G=31 MW m^{-2} K^{-1} at room temperature, two orders of magnitude lower than that of Al/Cu interfaces. For most as-transferred graphene on Cu films, G=20 MW m^{-2} K^{-1}, 35% lower than that of as-grown CVD graphene. We carefully rule out the contributions of residues, native oxides and interfaces roughness, and attribute the difference in the thermal conductance of as-grown and as-transferred CVD graphene to different degrees of conformity of graphene to the Cu substrates. We find that a contact area of 50% only reduces the thermal conductance by 35%, suggesting that a small amount of heat transfer occurs across voids at graphene interfaces. We successfully improve the conformity of the as-transferred graphene to the substrates by annealing the samples at 300°C, and thus enhance the thermal conductance of the transferred graphene to the intrinsic value. From the temperature dependence measurements of G of Al/trG/Cu and Al/grG/Cu interfaces, we also confirm that phonons are the dominant heat carries across the metal/graphene/metal interfaces despite a substantial carrier concentration of 3x10^{12} cm^{-2} induced in the graphene.
20 Pages, 4 figures
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