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20072025
most citedOxygen Evolution Reaction on Perovskites: A Multieffect Descriptor Study Combining Experimental and Theoretical Methods

134 citations

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cond-mat.mtrl-sci2024★ 1 cited

Colossal Seebeck coefficient of thermoelectric material calculated by space charge effect, and phonon drag background

Hirofumi Kakemoto

Recently colossal Seebeck coefficient () has found in the several thermoelectric (TE) materials. We present colossal and large thermal electron motivate force (EMF) reproduc…

cond-mat.mtrl-sci2021★ 16 cited

n-type electrical conduction in SnS thin films

Issei Suzuki, Sakiko Kawanishi, Sage R. Bauers +7

Tin monosulfide (SnS) usually exhibits p-type conduction due to the low formation enthalpy of acceptor-type defects, and as a result n-type SnS thin films have never been obtained.…

cond-mat.mtrl-sci2020★ 134 cited

Oxygen Evolution Reaction on Perovskites: A Multieffect Descriptor Study Combining Experimental and Theoretical Methods

Xi Cheng, Emiliana Fabbri, Yuya Yamashita +6

The correlation between ex situ electronic conductivity, oxygen vacancy content, flat-band potential (Efb), and the oxygen evolution reaction (OER) activity for a wide range of per…

cond-mat.mtrl-sci2017★ 128 cited

Diabatic Mechanisms of Higher-Order Harmonic Generation in Solid-State Materials under High-Intensity Electric Fields

T. Tamaya, A. Ishikawa, T. Ogawa +1

We theoretically investigate mechanisms of higher-order harmonic generation in solid-state materials under a high-intensity ac electric field. A new theoretical framework presented…

cond-mat.mtrl-sci2016★ 37 cited

Higher-Order Harmonic Generation caused by Elliptically Polarized Electric Fields in Solid-State Materials

T. Tamaya, A. Ishikawa, T. Ogawa +1

We theoretically investigated the dependence of higher-order harmonic generation (HHG) in solid-state materials on the ellipticity of the electric field. We found that in the multi…

cond-mat.mtrl-sci2007★ 34 cited

Conformal oxide coating of Carbon Nanotubes

S. Kawasaki, G. Catalan, H. Fan +8

The International Roadmap for Ferroelectric Memories requires three-dimensional integration of high-dielectric materials onto metal interconnects or bottom electrodes by 2010. We r…