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High Precision Devices (United States)

United States

1 paper here14 citations across 1
fields
  • cond-mat.supr-con1
ROR 034rmsp96OpenAlex

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most citedWafer-Scale Characterization of a Superconductor Integrated Circuit Fabrication Process, Using a Cryogenic Wafer Prober

14 citations

researchers with a paper here
  • A. Kurlej1 · h 5
  • A. Wynn1 · h 10
  • Chad I. Rogers1 · h 7
  • J. T. West1 · h 7
  • M. Gouker1 · h 12
  • S. K. Tolpygo1 · h 26
collaborating institutions
  • Massachusetts Institute of TechnologyUS1 paper
  • MIT Lincoln LaboratoryUS1 paper

1 paper

cond-mat.supr-con2021★ 14 cited

Wafer-Scale Characterization of a Superconductor Integrated Circuit Fabrication Process, Using a Cryogenic Wafer Prober

Joshua T. West, Arthur Kurlej, Alex Wynn +3

Using a fully automated cryogenic wafer prober, we measured superconductor fabrication process control monitors and simple integrated circuits on 200 mm wafers at 4.4 K, including…

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