Multi-Partner Project: COIN-3D -- Collaborative Innovation in 3D VLSI Reliability

George Rafael Gourdoumanis, Fotoini Oikonomou, Maria Pantazi-Kypraiou +10

As semiconductor manufacturing advances from the 3-nm process toward the sub-nanometer regime and transitions from FinFETs to gate-all-around field-effect transistors (GAAFETs), th…