5 papers
Design-Oriented Modeling of TSV Substrate Noise Coupling to Ring VCOs
Ilias Exouzidis, Alberto Garcia-Ortiz, George Floros +1
Through-silicon vias (TSVs) enable dense vertical interconnects in 3D-IC and chiplet systems, but their metal-oxide-silicon structure introduces significant parasitic coupling path…
Workload-Aware Early-Stage Power Delivery Network Optimization via Architectural Power Traces
Oran Hayes, Maria Pantazi-Kypraiou, Athanasios Tziouvaras +4
Power Delivery Networks (PDNs) are critical for maintaining voltage integrity in modern multiprocessor systems. Conventional early-stage PDN planning relies on static or worst-case…
Performance and Energy Trade-Off Analysis of Hierarchical Federated Learning for Plant Disease Classification
Athanasios Papanikolaou, Athanasios Tziouvaras, Pavlos Stoikos +6
Early detection of plant diseases is critical for improving crop productivity, while it also facilitates the foundations of precision agriculture. Recent advances in distributed de…
Active Imitation Learning for Thermal- and Kernel-Aware LFM Inference on 3D S-NUCA Many-Cores
Yixian Shen, Chaoyao Shen, Jan Deen +3
Large Foundation Model (LFM) inference is both memory- and compute-intensive, traditionally relying on GPUs. However, the limited availability and high cost have motivated the adop…
Multi-Partner Project: COIN-3D -- Collaborative Innovation in 3D VLSI Reliability
George Rafael Gourdoumanis, Fotoini Oikonomou, Maria Pantazi-Kypraiou +10
As semiconductor manufacturing advances from the 3-nm process toward the sub-nanometer regime and transitions from FinFETs to gate-all-around field-effect transistors (GAAFETs), th…