2 papers
cs.AR2026
Design-Oriented Modeling of TSV Substrate Noise Coupling to Ring VCOs
Ilias Exouzidis, Alberto Garcia-Ortiz, George Floros +1
Through-silicon vias (TSVs) enable dense vertical interconnects in 3D-IC and chiplet systems, but their metal-oxide-silicon structure introduces significant parasitic coupling path…
cs.AR2026
Multi-Partner Project: COIN-3D -- Collaborative Innovation in 3D VLSI Reliability
George Rafael Gourdoumanis, Fotoini Oikonomou, Maria Pantazi-Kypraiou +10
As semiconductor manufacturing advances from the 3-nm process toward the sub-nanometer regime and transitions from FinFETs to gate-all-around field-effect transistors (GAAFETs), th…