2 citations · 6 across the 6 of their papers we have counts for
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Calculation and selection of silicon to glass anodic bonding modes based on the criterion of minimum residual stress
Leonid S. Sinev
The goal of this work is a scientifically justified choice of efficient technological parameters of anodic bonding of silicon to glass, ensuring a minimum level of residual stresse…
Mechanical Stresses Estimation in Silicon and Glass Bonded at Elevated Temperature
Leonid S. Sinev
During electrostatic bonding, also known as anodic bonding, silicon is bonded to glass by applying an external voltage and simultaneous heating to temperatures of 200...450 C. W…
Coefficient of Thermal Expansion Mismatch Induced Stress Calculation for Field Assisted Bonding of Silicon to Glass
Leonid S. Sinev, Vladimir T. Ryabov
The residual stress induced in assembly is a common concern in electronic packaging. The mismatch in coefficient of thermal expansion between borosilicate glass and silicon, upon t…
Coefficient of Thermal Expansion Balancing for Field Assisted Bonding of Silicon to Glass
Leonid S. Sinev, Vladimir T. Ryabov
Stresses caused by thermal expansion coefficients mismatch of anodically bonded glass and silicon samples are studied. An analytical model to determine graphically the optimum bond…