1 citations · 1 across the 1 of their papers we have counts for
3 papers
physics.app-ph2018
Calculation and selection of silicon to glass anodic bonding modes based on the criterion of minimum residual stress
Leonid S. Sinev
The goal of this work is a scientifically justified choice of efficient technological parameters of anodic bonding of silicon to glass, ensuring a minimum level of residual stresse…
cond-mat.mtrl-sci2018
Mechanical Stresses Estimation in Silicon and Glass Bonded at Elevated Temperature
Leonid S. Sinev
During electrostatic bonding, also known as anodic bonding, silicon is bonded to glass by applying an external voltage and simultaneous heating to temperatures of 200...450 C. W…
physics.app-ph2017★ 1 cited
Linear thermal expansion coefficient (at temperatures from 130 to 800 K) of borosilicate glasses applicable for coupling with silicon in microelectronics
Leonid S. Sinev, Ivan D. Petrov
Processing results of measurements of linear thermal expansion coefficients and linear thermal expansion of two brands of borosilicate glasses --- LK5 and Borofloat 33 --- are pres…