2 citations · 6 across the 6 of their papers we have counts for
8 papers
Zarya: A Hybrid Autoregressive--Masked Diffusion Language Model with Flexible Training and Dual-Mode Inference
Leonid Sinev, Ilya Koziev, Vladislav Leshchuk
Autoregressive language models (ARMs) are constrained by sequential, left-to-right generation, while masked diffusion models (MDMs) enable parallel decoding but suffer from high co…
Evaluating Losslessness in Speculative Decoding Under Finite-Precision Inference
Ilya Koziev, Leonid Sinev, Ivan Oseledets
Lossless speculative decoding is typically defined at the algorithmic level: a speculative procedure proposes multiple tokens and a verification procedure is designed to preserve t…
MERA: A Comprehensive LLM Evaluation in Russian
Alena Fenogenova, Artem Chervyakov, Nikita Martynov +16
Over the past few years, one of the most notable advancements in AI research has been in foundation models (FMs), headlined by the rise of language models (LMs). As the models' siz…
Calculation and selection of silicon to glass anodic bonding modes based on the criterion of minimum residual stress
Leonid S. Sinev
The goal of this work is a scientifically justified choice of efficient technological parameters of anodic bonding of silicon to glass, ensuring a minimum level of residual stresse…
Mechanical Stresses Estimation in Silicon and Glass Bonded at Elevated Temperature
Leonid S. Sinev
During electrostatic bonding, also known as anodic bonding, silicon is bonded to glass by applying an external voltage and simultaneous heating to temperatures of 200...450 C. W…
Coefficient of Thermal Expansion Mismatch Induced Stress Calculation for Field Assisted Bonding of Silicon to Glass
Leonid S. Sinev, Vladimir T. Ryabov
The residual stress induced in assembly is a common concern in electronic packaging. The mismatch in coefficient of thermal expansion between borosilicate glass and silicon, upon t…
Coefficient of Thermal Expansion Balancing for Field Assisted Bonding of Silicon to Glass
Leonid S. Sinev, Vladimir T. Ryabov
Stresses caused by thermal expansion coefficients mismatch of anodically bonded glass and silicon samples are studied. An analytical model to determine graphically the optimum bond…
Linear thermal expansion coefficient (at temperatures from 130 to 800 K) of borosilicate glasses applicable for coupling with silicon in microelectronics
Leonid S. Sinev, Ivan D. Petrov
Processing results of measurements of linear thermal expansion coefficients and linear thermal expansion of two brands of borosilicate glasses --- LK5 and Borofloat 33 --- are pres…