3 papers
math.NA2025
ATMPlace: Analytical Thermo-Mechanical-Aware Placement Framework for 2.5D-IC
Qipan Wang, Tianxiang Zhu, Tianyu Jia +3
Rising demand in AI and automotive applications is accelerating 2.5D IC adoption, with multiple chiplets tightly placed to enable high-speed interconnects and heterogeneous integra…
cs.AR2025
EdgeMM: Multi-Core CPU with Heterogeneous AI-Extension and Activation-aware Weight Pruning for Multimodal LLMs at Edge
Kangbo Bai, Le Ye, Ru Huang +1
Emerging multimodal LLMs (MLLMs) exhibit strong cross-modality perception and reasoning capabilities and hold great potential for various applications at edge. However, MLLMs typic…
cs.AR2025
Leveraging Compute-in-Memory for Efficient Generative Model Inference in TPUs
Zhantong Zhu, Hongou Li, Wenjie Ren +4
With the rapid advent of generative models, efficiently deploying these models on specialized hardware has become critical. Tensor Processing Units (TPUs) are designed to accelerat…