Showing physics.app-phShow all
2 papers · 1 filter
physics.app-ph2026
ATSim3.5D: A Multiscale Thermal Simulator for 3.5D-IC Systems based on Nonlinear Multigrid Method
Qipan Wang, Tianxiang Zhu, Yibo Lin +2
To resolve the rising temperatures in 3.5D-ICs, a thermal-aware design flow becomes increasingly crucial, necessitating an accurate and efficient thermal simulation tool. However,…
physics.app-ph2025
A Tale of Two Sides of Wafer: Physical Implementation and Block-Level PPA on Flip FET with Dual-sided Signals
Haoran Lu, Xun Jiang, Yanbang Chu +7
As the conventional scaling of logic devices comes to an end, functional wafer backside and 3D transistor stacking are consensus for next-generation logic technology, offering cons…