M. Boscardin

activity

20092022

most citedRadiation resistant LGAD design

133 citations · 612 across the 29 of their papers we have counts for

collaborators

Showing 2019Show all

3 papers · 1 filter

physics.ins-det2019★ 60 cited

First demonstration of 200, 100, and 50 um pitch Resistive AC-Coupled Silicon Detectors (RSD) with 100% fill-factor for 4D particle tracking

M. Mandurrino, R. Arcidiacono, M. Boscardin +8

We designed, produced, and tested RSD (Resistive AC-Coupled Silicon Detectors) devices, an evolution of the standard LGAD (Low-Gain Avalanche Diode) technology where a resistive n-…

physics.ins-det2019★ 8 cited

First Results on 3D Pixel Sensors Interconnected to the RD53A Readout Chip after Irradiation to $1 \times$ $1 0^{16}$ neq cm $^{- 2}$

M. Meschini, R. Ceccarelli, M. Dinardo +18

Results obtained with 3D columnar pixel sensors bump-bonded to the RD53A prototype readout chip are reported. The interconnected modules have been tested in a hadron beam before an…

physics.ins-det2019★ 11 cited

Results on Proton-Irradiated 3D Pixel Sensors Interconnected to RD53A Readout ASIC

Jordi Duarte-Campderros, Esteban Curras, Marcos Fernandez +19

Test beam results obtained with 3D pixel sensors bump-bonded to the RD53A prototype readout ASIC are reported. Sensors from FBK (Italy) and IMB-CNM (Spain) have been tested before…

First demonstration of 200, 100, and 50 um pitch Resistive AC-Coupled Silicon Detectors (RSD) with 100% fill-factor for 4D particle tracking

First Results on 3D Pixel Sensors Interconnected to the RD53A Readout Chip after Irradiation to 1×1016neq cm−2

Results on Proton-Irradiated 3D Pixel Sensors Interconnected to RD53A Readout ASIC

First Results on 3D Pixel Sensors Interconnected to the RD53A Readout Chip after Irradiation to $1 \times$ $1 0^{16}$ neq cm $^{- 2}$