Atomic-Scale Phonon Engineering for Enhanced Thermal Transport in Wafer-Scale-Bonded $\beta$-Ga${}_2$O${}_3$/SiC Heterostructures

J. Liu, R. Mao, Z. Liu +6

Bonding semiconductors to substrates with high thermal conductivity is a promising way to solve the heat-dissipation problem of materials that transport heat poorly, and it avoids…