32 citations · 60 across the 4 of their papers we have counts for
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physics.ins-det2009★ 1 cited
Demonstration of fine pitch FCOB (Flip Chip on Board) assembly based on solder bumps at Fermilab
M. Trimpl, E. Skup, R. Yarema +1
Bump bonding is a superior assembly alternative compared to conventional wire bond techniques. It offers a highly reliable connection with greatly reduced parasitic properties. The…
physics.ins-det2006★ 9 cited
Status of a DEPFET pixel system for the ILC vertex detector
M. Trimpl, M. Koch, R. Kohrs +14
We have developed a prototype system for the ILC vertex detector based on DEPFET pixels. The system operates a 128x64 matrix (with ~35x25 square micron large pixels) and uses two d…
physics.ins-det2003★ 18 cited
New Results on DEPFET Pixel Detectors for Radiation Imaging and High Energy Particle Detection
N. Wermes, L. Andricek, P. Fischer +19
DEPFET pixel detectors are unique devices in terms of energy and spatial resolution because very low noise (ENC = 2.2e at room temperature) operation can be obtained by implementin…