32 citations · 60 across the 4 of their papers we have counts for
4 papers
Demonstration of fine pitch FCOB (Flip Chip on Board) assembly based on solder bumps at Fermilab
M. Trimpl, E. Skup, R. Yarema +1
Bump bonding is a superior assembly alternative compared to conventional wire bond techniques. It offers a highly reliable connection with greatly reduced parasitic properties. The…
Status of a DEPFET pixel system for the ILC vertex detector
M. Trimpl, M. Koch, R. Kohrs +14
We have developed a prototype system for the ILC vertex detector based on DEPFET pixels. The system operates a 128x64 matrix (with ~35x25 square micron large pixels) and uses two d…
New Results on DEPFET Pixel Detectors for Radiation Imaging and High Energy Particle Detection
N. Wermes, L. Andricek, P. Fischer +19
DEPFET pixel detectors are unique devices in terms of energy and spatial resolution because very low noise (ENC = 2.2e at room temperature) operation can be obtained by implementin…
Readout Concepts for DEPFET Pixel Arrays
P. Fischer, W. Neeser, M. Trimpl +2
Field effect transistors embedded into a depleted silicon bulk (DEPFETs) can be used as the first amplifying element for the detection of small signal charges deposited in the bulk…