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eess.IV2026★ 1 cited
Design Guidelines for In-line X-ray Inspection in Advanced Packaging Technology: A CoWoS Case Study
Katayoon Yahyaei, M Shafkat M Khan, Guillermo Cadima +2
The shift towards advanced packaging technologies, including 2.5D and 3D integration, addresses the limitations of traditional methods while meeting increasing demands for performa…
eess.IV2023
In-Situ Thickness Measurement of Die Silicon Using Voltage Imaging for Hardware Assurance
Olivia P. Dizon-Paradis, Nitin Varshney, M Tanjidur Rahman +3
Hardware assurance of electronics is a challenging task and is of great interest to the government and the electronics industry. Physical inspection-based methods such as reverse e…