4 papers
Enhancing Co-packaging Optics Enabled Silicon Photonics Security Assurance Hardware Fingerprinting
Liton Kumar Biswas, M Shafkat M Khan, Himanandhan Reddy Kottur +3
Silicon photonics enables integration of optical components using standard semiconductor processes, greatly improving data communication bandwidth and energy efficiency. However, p…
AI-Driven Thermal Mapping and Management in 3D Integrated Photonic Circuits
Liton Kumar Biswas, Katayoon Yahyaei, Shajib Ghosh +5
Photonic Integrated Circuits (PICs) are advancing high-performance computing, data centers, and sensing, yet three-dimensional (3D) PICs introduce critical thermal management chall…
Design Guidelines for In-line X-ray Inspection in Advanced Packaging Technology: A CoWoS Case Study
Katayoon Yahyaei, M Shafkat M Khan, Guillermo Cadima +2
The shift towards advanced packaging technologies, including 2.5D and 3D integration, addresses the limitations of traditional methods while meeting increasing demands for performa…
Nanoelectromechanical Systems (NEMS) for Hardware Security in Advanced Packaging
Himanandhan Reddy Kottur, Pavanbabu Arjunamahanthi, M. Shafkat M. Khan +3
As hardware security threats escalate across semiconductor manufacturing and advanced packaging, there is a growing need for novel physical mechanisms to counter sophisticated atta…