13 citations · 20 across the 7 of their papers we have counts for
7 papers
Enhancing Co-packaging Optics Enabled Silicon Photonics Security Assurance Hardware Fingerprinting
Liton Kumar Biswas, M Shafkat M Khan, Himanandhan Reddy Kottur +3
Silicon photonics enables integration of optical components using standard semiconductor processes, greatly improving data communication bandwidth and energy efficiency. However, p…
AI-Driven Thermal Mapping and Management in 3D Integrated Photonic Circuits
Liton Kumar Biswas, Katayoon Yahyaei, Shajib Ghosh +5
Photonic Integrated Circuits (PICs) are advancing high-performance computing, data centers, and sensing, yet three-dimensional (3D) PICs introduce critical thermal management chall…
Design Guidelines for In-line X-ray Inspection in Advanced Packaging Technology: A CoWoS Case Study
Katayoon Yahyaei, M Shafkat M Khan, Guillermo Cadima +2
The shift towards advanced packaging technologies, including 2.5D and 3D integration, addresses the limitations of traditional methods while meeting increasing demands for performa…
Nanoelectromechanical Systems (NEMS) for Hardware Security in Advanced Packaging
Himanandhan Reddy Kottur, Pavanbabu Arjunamahanthi, M. Shafkat M. Khan +3
As hardware security threats escalate across semiconductor manufacturing and advanced packaging, there is a growing need for novel physical mechanisms to counter sophisticated atta…
US Microelectronics Packaging Ecosystem: Challenges and Opportunities
Rouhan Noor, Himanandhan Reddy Kottur, Patrick J Craig +9
The semiconductor industry is experiencing a significant shift from traditional methods of shrinking devices and reducing costs. Chip designers actively seek new technological solu…
From Talent Shortage to Workforce Excellence in the CHIPS Act Era: Harnessing Industry 4.0 Paradigms for a Sustainable Future in Domestic Chip Production
Aida Damanpak Rizi, Antika Roy, Rouhan Noor +8
The CHIPS Act is driving the U.S. towards a self-sustainable future in domestic chip production. Decades of outsourced manufacturing, assembly, testing, and packaging has diminishe…
In-Situ Thickness Measurement of Die Silicon Using Voltage Imaging for Hardware Assurance
Olivia P. Dizon-Paradis, Nitin Varshney, M Tanjidur Rahman +3
Hardware assurance of electronics is a challenging task and is of great interest to the government and the electronics industry. Physical inspection-based methods such as reverse e…