2 papers
cond-mat.mtrl-sci2026
A Novel Decoupling Method for Investigating Distinct Domain Evolution in Ferroelectric Film
Keying Sun, Jiajun Qiu, Hao Li +5
Conventional polarization characterization techniques provide only the averaged response of ferroelectric films, limiting the investigation of domain-dependent reliability mechanis…
cond-mat.mes-hall2024
From Flip FET to Flip 3D Integration (F3D): Maximizing the Scaling Potential of Wafer Both Sides Beyond Conventional 3D Integration
Heng Wu, Haoran Lu, Wanyue Peng +13
In this work, we proposed a new 3D integration technology: the Flip 3D integration (F3D), consisting of the 3D transistor stacking, the 3D dual-sided interconnects, the 3D die-to-d…