activity
20072023
most citedThermal rectification and negative differential thermal resistance in lattices with mass gradient

267 citations · 2.7k across the 65 of their papers we have counts for

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Showing cond-mat.mtrl-sciShow all

19 papers · 1 filter

cond-mat.mtrl-sci2023

Enhancing interfacial thermal conductance of Si/PVDF by strengthening atomic couplings

Zhicheng Zong, Shichen Deng, Yangjun Qin +4

The thermal transport across inorganic/organic interfaces attracts interest for both academic and industry due to its widely applications in flexible electronics etc. Here, the int…

cond-mat.mtrl-sci2022

Modulating Thermal Conductivity via Targeted Phonon Excitation

Xiao Wan, Dongkai Pan, Jing-Tao Lü +6

Thermal conductivity is a critical material property in numerous applications, such as those related to thermoelectric devices and heat dissipation. Effectively modulating thermal…

cond-mat.mtrl-sci2021★ 4 cited

Thermal Conductivities and Mechanical Properties of Epoxy Resin as a Function of the Degree of Cross-linking

Xiao Wan, Baris Demir, Meng An +2

Epoxy resins are widely used polymer matrices for numerous applications. Despite substantial advances, the molecular-level knowledge-base required to exploit these materials to the…

cond-mat.mtrl-sci2020★ 51 cited

Maximization and Minimization of Interfacial Thermal Conductance by Modulating the Mass Distribution of Interlayer

Lina Yang, Xiao Wan, Dengke Ma +2

Tuning interfacial thermal conductance has been a key task for the thermal management of nanoelectronic devices. Here, it is studied how the interfacial thermal conductance is grea…

cond-mat.mtrl-sci2019★ 137 cited

Materials discovery and properties prediction in thermal transport via materials informatics: a mini-review

Xiao Wan, Wentao Feng, Yunpeng Wang +2

There has been an increasing demand for materials with special thermal properties, whereas experimental discovery is high-cost and time-consuming. The emerging discipline `Material…

cond-mat.mtrl-sci2018★ 5 cited

High thermal conductivity of bulk epoxy resin by bottom-up parallel-linking and strain: a molecular dynamics study

Shouhang Li, Xiaoxiang Yu, Hua Bao +1

The ultra-low thermal conductivity (~0.3 Wm-1K-1) of amorphous epoxy resins significantly limits their applications in electronics. Conventional top-down methods e.g. electrospinni…