353 citations · 1.5k across the 36 of their papers we have counts for
8 papers · 1 filter
Angstrom-Scale Imaging of Magnetization in Antiferromagnetic FeAs via 4D-STEM
Kayla X. Nguyen, Jeffrey Huang, Manohar H. Karigerasi +6
We demonstrate a combination of computational tools and experimental 4D-STEM methods to image the local magnetic moment in antiferromagnetic FeAs with 6 angstrom spatial resolu…
Ionic Peltier Effect in Li-Ion Electrolytes
Zhe Cheng, Yu-Ju Huang, Beniamin Zahiri +3
The coupled transport of charge and heat provide fundamental insights into the microscopic thermodynamics and kinetics of materials. We describe a sensitive ac differential resista…
Electron paramagnetic resonance of n-type silicon and germanium for applications in 3D thermometry
Darshan Chalise, David G. Cahill
While several 2D thermometry techniques exist, there is a lack of 3D thermometry techniques that work for wide range of materials and offer good resolution in time, space and tempe…
Frequency-domain probe beam deflection method for measurement of thermal conductivity of materials on micron length scale
Jinchi Sun, Guangxin Lv, David G. Cahill
Time-domain thermoreflectance (TDTR) and frequency-domain thermoreflectance (FDTR) have been widely used for non-contact measurement of anisotropic thermal conductivity of material…
Topological Metal MoP Nanowire for Interconnect
Hyeuk Jin Han, Sushant Kumar, Xiaoyang Ji +9
The increasing resistance of Cu interconnects for decreasing dimensions is a major challenge in continued downscaling of integrated circuits beyond the 7-nm technology node as it l…
High Thermal Conductivity in Wafer Scale Cubic Silicon Carbide Crystals
Zhe Cheng, Jianbo Liang, Keisuke Kawamura +7
High thermal conductivity electronic materials are critical components for high-performance electronic and photonic devices as either active functional materials or thermal managem…