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20002023
most citedHeat Conduction across Monolayer and Few-Layer Graphenes

353 citations · 1.5k across the 36 of their papers we have counts for

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22 papers · 1 filter

cond-mat.mtrl-sci2023

Temperature dependence of 7Li NMR relaxation rates in Li3InCl6, Li3YCl6, Li1.48Al0.48Ge1.52(PO4)3 and LiPS5Cl

Darshan Chalise, Carlos Juarez-Yescas, Beniamin Zahiri +2

Inorganic solid-state battery electrolytes show high ionic conductivities and enable the fabrication of all solid-state batteries. In this work, we present the temperature dependen…

cond-mat.mtrl-sci2023

Simultaneous mapping of temperature and hydration in proton exchange membrane of fuel cells using magnetic resonance imaging

Darshan Chalise, Shreyan Majumdar, David G. Cahill

The efficiency of a proton exchange membrane (PEM) fuel cell depends on the mobility of protons in the PEM, which is determined by the hydration and temperature of the membrane. Wh…

cond-mat.mtrl-sci2022★ 10 cited

Angstrom-Scale Imaging of Magnetization in Antiferromagnetic FeAs via 4D-STEM

Kayla X. Nguyen, Jeffrey Huang, Manohar H. Karigerasi +6

We demonstrate a combination of computational tools and experimental 4D-STEM methods to image the local magnetic moment in antiferromagnetic FeAs with 6 angstrom spatial resolu…

cond-mat.mtrl-sci2022

Ionic Peltier Effect in Li-Ion Electrolytes

Zhe Cheng, Yu-Ju Huang, Beniamin Zahiri +3

The coupled transport of charge and heat provide fundamental insights into the microscopic thermodynamics and kinetics of materials. We describe a sensitive ac differential resista…

cond-mat.mtrl-sci2022

Electron paramagnetic resonance of n-type silicon and germanium for applications in 3D thermometry

Darshan Chalise, David G. Cahill

While several 2D thermometry techniques exist, there is a lack of 3D thermometry techniques that work for wide range of materials and offer good resolution in time, space and tempe…

cond-mat.mtrl-sci2022★ 1 cited

Topological Metal MoP Nanowire for Interconnect

Hyeuk Jin Han, Sushant Kumar, Xiaoyang Ji +9

The increasing resistance of Cu interconnects for decreasing dimensions is a major challenge in continued downscaling of integrated circuits beyond the 7-nm technology node as it l…