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quant-ph2026
Accurate gap control of 3D-integrated superconducting quantum circuits using asymmetric indium architecture and multi-angle flip-chip bonding
L. Richard, N. Bruckmoser, J. Feigl +8
Flip-chip 3D integration is a key enabling technology for overcoming the routing and layout constraints of planar superconducting quantum processors, but it requires accurate and u…
quant-ph2025★ 3 cited
Niobium Air Bridges as Low-Loss Components for Superconducting Quantum Hardware
N. Bruckmoser, L. Koch, I. Tsitsilin +12
Scaling up superconducting quantum processors requires a high routing density for readout and control lines, relying on low-loss interconnects to maintain design flexibility and de…