36 citations · 38 across the 3 of their papers we have counts for
3 papers
Accelerated Discovery of Topological Conductors for Nanoscale Interconnects
Alexander C. Tyner, William Rogers, Po-Hsin Shih +5
The sharp increase in resistivity of copper interconnects at ultra-scaled dimensions threatens the continued miniaturization of integrated circuits. Topological semimetals (TSMs) w…
Surface-dominant transport in Weyl semimetal NbAs nanowires for next-generation interconnects
Yeryun Cheon, Mehrdad T. Kiani, Yi-Hsin Tu +20
Ongoing demands for smaller and more energy efficient electronic devices necessitate alternative interconnect materials with lower electrical resistivity at reduced dimensions. Des…
Surface conduction and reduced electrical resistivity in ultrathin noncrystalline NbP semimetal
Asir Intisar Khan, Akash Ramdas, Emily Lindgren +9
The electrical resistivity of conventional metals, such as copper, is known to increase in thin films due to electron-surface scattering, limiting the performance of metals in nano…