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cs.AR2026
EMSpice 3: Full-chip Temperature-Aware Multiphysics Electromigration and IR-Drop Analysis
Haotian Lu, Sheldon X. -D. Tan
This paper presents EMSpice~3, a full-chip multiphysics framework for coupled electromigration (EM), thermomigration (TM), and IR-drop analysis of practical power-grid (P/G) networ…
cs.AR2026
Accelerating Physics-Based Electromigration Analysis via Rational Krylov Subspaces
Sheldon X. -D. Tan, Haotian Lu
Electromigration (EM) induced stress evolution is a major reliability challenge in nanometer-scale VLSI interconnects. Accurate EM analysis requires solving stress-governing partia…
cs.AR2026
WarPGNN: A Parametric Thermal Warpage Analysis Framework with Physics-aware Graph Neural Network
Haotian Lu, Jincong Lu, Sachin Sachdeva +1
With the advent of system-in-package (SiP) chiplet-based design and heterogeneous 2.5D/3D integration, thermal-induced warpage has become a critical reliability concern. While conv…