2 papers
eess.SY2025
EMSpice 2.1: A Coupled EM and IR Drop Analysis Tool with Joule Heating and Thermal Map Integration for VLSI Reliability
Subed Lamichhane, Haotian Lu, Sheldon X. -D. Tan
Electromigration (EM) remains a critical reliability concern in current and future copper-based VLSI circuits. As technology scales down, EM-induced IR drop becomes increasingly se…
cs.LG2025
BPINN-EM-Post: Bayesian Physics-Informed Neural Network based Stochastic Electromigration Damage Analysis in the Post-void Phase
Subed Lamichhane, Haotian Lu, Sheldon X. -D. Tan
In contrast to the assumptions of most existing Electromigration (EM) analysis tools, the evolution of EM-induced stress is inherently non-deterministic, influenced by factors such…