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cs.AR2025
Shift-Left Techniques in Electronic Design Automation: A Survey
Xinyue Wu, Zixuan Li, Fan Hu +4
The chip design process involves numerous steps, beginning with defining product requirements and progressing through architectural planning, system-level design, and the physical…
cs.AR2025
Cool-3D: An End-to-End Thermal-Aware Framework for Early-Phase Design Space Exploration of Microfluidic-Cooled 3DICs
Runxi Wang, Ziheng Wang, Ting Lin +3
The rapid advancement of three-dimensional integrated circuits (3DICs) has heightened the need for early-phase design space exploration (DSE) to minimize design iterations and unex…
cs.AR2024★ 1 cited
Hot-LEGO: Architect Microfluidic Cooling Equipped 3DICs with Pre-RTL Thermal Simulation
Runxi Wang, Jun-Han Han, Mircea Stan +1
Microfluidic cooling has been recognized as one of the most promising solutions to achieve efficient thermal management for three-dimensional integrated circuits (3DICs). It enable…