1 citations · 1 across the 2 of their papers we have counts for
2 papers
cs.AR2025
Cool-3D: An End-to-End Thermal-Aware Framework for Early-Phase Design Space Exploration of Microfluidic-Cooled 3DICs
Runxi Wang, Ziheng Wang, Ting Lin +3
The rapid advancement of three-dimensional integrated circuits (3DICs) has heightened the need for early-phase design space exploration (DSE) to minimize design iterations and unex…
cs.AR2024★ 1 cited
Hot-LEGO: Architect Microfluidic Cooling Equipped 3DICs with Pre-RTL Thermal Simulation
Runxi Wang, Jun-Han Han, Mircea Stan +1
Microfluidic cooling has been recognized as one of the most promising solutions to achieve efficient thermal management for three-dimensional integrated circuits (3DICs). It enable…