activity
20232026
most citedRobust quantum engineering of current flow in carbon nanostructures at room temperature

4 citations · 7 across the 7 of their papers we have counts for

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Showing cond-mat.mtrl-sciShow all

6 papers · 1 filter

cond-mat.mtrl-sci2026

From Amorphous to Amorphous-Crystalline Mixed-Phase Boron Nitride: Evolution of the Thermal and Elastic Properties

Jiaqi Yang, Thomas Souvignet, Onurcan Kaya +11

Amorphous boron nitride (aBN) is a promising dielectric and protective coating, yet its nanoscale heat dissipation and elastic response remain poorly quantified. Here we synthesize…

cond-mat.mtrl-sci2025

Atomic-Scale Origins of Oxidation Resistance in Amorphous Boron Nitride

Onurcan Kaya, Qiushi Deng, Thomas Souvignet +4

Amorphous boron nitride (\textrm{}-BN) is a promising ultrathin barrier for nanoelectronics, yet the atomistic mechanisms governing its chemical stability remain poorly understo…

cond-mat.mtrl-sci2024★ 2 cited

2D Hexagonal Boron Nitride-based Anticorrosion Coatings

Onurcan Kaya, Luca Gabatel, Sebastiano Bellani +4

The corrosion of metallic surfaces poses significant challenges across industries such as petroleum, energy, and biomedical sectors, leading to structural degradation, safety risks…

cond-mat.mtrl-sci2024

Exploring Dielectric Properties in Models of Amorphous Boron Nitride

Thomas Galvani, Ali K. Hamze, Laura Caputo +8

We report a theoretical study of dielectric properties of models of amorphous Boron Nitride, using interatomic potentials generated by machine learning. We first perform first-prin…

cond-mat.mtrl-sci2024★ 1 cited

Amorphous Boron Nitride as an Ultrathin Copper Diffusion Barrier for Advanced Interconnects

Onurcan Kaya, Hyeongjoon Kim, Byeongkyu Kim +7

This study focuses on amorphous boron nitride (-BN) as a novel diffusion barrier for advanced semiconductor technology, particularly addressing the critical challenge of cop…

cond-mat.mtrl-sci2023

Impact of Hydrogenation on the Stability and Mechanical Properties of Amorphous Boron Nitride

Onurcan Kaya, Luigi Colombo, Aleandro Antidormi +4

Interconnect materials with ultralow dielectric constant, and good thermal and mechanical properties are crucial for the further miniaturization of electronic devices. Recently, it…