4 citations · 7 across the 7 of their papers we have counts for
7 papers
From Amorphous to Amorphous-Crystalline Mixed-Phase Boron Nitride: Evolution of the Thermal and Elastic Properties
Jiaqi Yang, Thomas Souvignet, Onurcan Kaya +11
Amorphous boron nitride (aBN) is a promising dielectric and protective coating, yet its nanoscale heat dissipation and elastic response remain poorly quantified. Here we synthesize…
Atomic-Scale Origins of Oxidation Resistance in Amorphous Boron Nitride
Onurcan Kaya, Qiushi Deng, Thomas Souvignet +4
Amorphous boron nitride (\textrm{}-BN) is a promising ultrathin barrier for nanoelectronics, yet the atomistic mechanisms governing its chemical stability remain poorly understo…
2D Hexagonal Boron Nitride-based Anticorrosion Coatings
Onurcan Kaya, Luca Gabatel, Sebastiano Bellani +4
The corrosion of metallic surfaces poses significant challenges across industries such as petroleum, energy, and biomedical sectors, leading to structural degradation, safety risks…
Robust quantum engineering of current flow in carbon nanostructures at room temperature
Gaetano Calogero, Isaac Alcón, Onurcan Kaya +4
Bottom-up on-surface synthesis enables the fabrication of carbon nanostructures with atomic precision. Good examples are graphene nanoribbons (GNRs), 1D conjugated polymers, and na…
Exploring Dielectric Properties in Models of Amorphous Boron Nitride
Thomas Galvani, Ali K. Hamze, Laura Caputo +8
We report a theoretical study of dielectric properties of models of amorphous Boron Nitride, using interatomic potentials generated by machine learning. We first perform first-prin…
Amorphous Boron Nitride as an Ultrathin Copper Diffusion Barrier for Advanced Interconnects
Onurcan Kaya, Hyeongjoon Kim, Byeongkyu Kim +7
This study focuses on amorphous boron nitride (-BN) as a novel diffusion barrier for advanced semiconductor technology, particularly addressing the critical challenge of cop…
Impact of Hydrogenation on the Stability and Mechanical Properties of Amorphous Boron Nitride
Onurcan Kaya, Luigi Colombo, Aleandro Antidormi +4
Interconnect materials with ultralow dielectric constant, and good thermal and mechanical properties are crucial for the further miniaturization of electronic devices. Recently, it…