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20242026
most citedARIM-mdx Data System: Towards a Nationwide Data Platform for Materials Science

5 citations · 17 across the 12 of their papers we have counts for

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Showing cond-mat.mtrl-sciShow all

8 papers · 1 filter

cond-mat.mtrl-sci2026

Fast and Accurate Prediction of Lattice Thermal Conductivity via Machine Learning Surrogates

Zeyu Wang, Shuya Yamazaki, Martin Hoffmann Petersen +11

The appearance of generative models has opened vast chemical spaces in the design of functional materials. Although machine learning interatomic potentials (MLIPs) have substantial…

cond-mat.mtrl-sci2025

Suppression of Thin-Film Thermal Conductivity due to Surface Roughness

Michimasa Morita, Junichiro Shiomi

Understanding thermal transport in silicon nanostructures is crucial for effective thermal management in semiconductor devices. In such nanostructures, boundary scattering can sign…

cond-mat.mtrl-sci2025

Revisiting the Mechanisms of Thermal Transport in Vacancy-Defective Silicon

Xueyan Zhu, Jin Yang, J. Shiomi +1

Understanding heat conduction in defective silicon is crucial for electronics and thermoelectrics. Conventional understanding relies on phonon gas picture, treating defects as scat…

cond-mat.mtrl-sci2025

Database and deep-learning scalability of anharmonic phonon properties by automated brute-force first-principles calculations

Masato Ohnishi, Tianqi Deng, Pol Torres +16

Understanding the anharmonic phonon properties of crystal compounds -- such as phonon lifetimes and thermal conductivities -- is essential for investigating and optimizing their th…

cond-mat.mtrl-sci2025

High thermoelectric power factor in Ni-Fe alloy for active cooling applications

Shuai Li, Sree Sourav Das, Haobo Wang +5

Metallic thermoelectric materials are promising candidates for active cooling applications, where high thermal conductivity and a high thermoelectric power factor are essential to…

cond-mat.mtrl-sci2024

Enhancing and Mapping Thermal Boundary Conductance across Bonded Si/SiC Interface

Rulei Guo, Bin Xu, Fengwen Mu +1

SiC is a promising substrate for Si-on-insulator (SOI) wafers for efficient thermal management owing to its high thermal conductivity and large bandgap. However, fabricating a Si d…

cond-mat.mtrl-sci2024★ 1 cited

Low thermal boundary resistance at bonded GaN/diamond interface by controlling ultrathin heterogeneous amorphous layer

Bin Xu, Fengwen Mu, Yingzhou Liu +3

Thermal boundary resistance (TBR) in semiconductor-on-diamond structure bottlenecks efficient heat dissipation in electronic devices. In this study, to reduce the TBR between GaN a…

cond-mat.mtrl-sci2024★ 5 cited

Non-equilibrium Magnon Engineering Enabling Significant Thermal Transport Modulation

Takamasa Hirai, Toshiaki Morita, Subrata Biswas +13

Thermal conductivity, a fundamental parameter characterizing thermal transport in solids, is typically determined by electron and phonon transport. Although other transport propert…