5 citations · 17 across the 12 of their papers we have counts for
12 papers
Janus-induced atomic reconstruction amplifies twist-angle modulation of interlayer thermal transport in moiré bilayers
Bin Xu, Rulei Guo, Jie Sun +8
In two-dimensional moiré bilayers, atomic reconstruction, the spontaneous structural relaxation toward energy-minimizing stacking registries in the near-commensurate regime, can st…
Fast and Accurate Prediction of Lattice Thermal Conductivity via Machine Learning Surrogates
Zeyu Wang, Shuya Yamazaki, Martin Hoffmann Petersen +11
The appearance of generative models has opened vast chemical spaces in the design of functional materials. Although machine learning interatomic potentials (MLIPs) have substantial…
Omics-scale polymer computational database transferable to real-world artificial intelligence applications
Ryo Yoshida, Yoshihiro Hayashi, Hidemine Furuya +103
Developing large-scale foundational datasets is a critical milestone in advancing artificial intelligence (AI)-driven scientific innovation. However, unlike AI-mature fields such a…
Suppression of Thin-Film Thermal Conductivity due to Surface Roughness
Michimasa Morita, Junichiro Shiomi
Understanding thermal transport in silicon nanostructures is crucial for effective thermal management in semiconductor devices. In such nanostructures, boundary scattering can sign…
Revisiting the Mechanisms of Thermal Transport in Vacancy-Defective Silicon
Xueyan Zhu, Jin Yang, J. Shiomi +1
Understanding heat conduction in defective silicon is crucial for electronics and thermoelectrics. Conventional understanding relies on phonon gas picture, treating defects as scat…
Database and deep-learning scalability of anharmonic phonon properties by automated brute-force first-principles calculations
Masato Ohnishi, Tianqi Deng, Pol Torres +16
Understanding the anharmonic phonon properties of crystal compounds -- such as phonon lifetimes and thermal conductivities -- is essential for investigating and optimizing their th…
High thermoelectric power factor in Ni-Fe alloy for active cooling applications
Shuai Li, Sree Sourav Das, Haobo Wang +5
Metallic thermoelectric materials are promising candidates for active cooling applications, where high thermal conductivity and a high thermoelectric power factor are essential to…
ARIM-mdx Data System: Towards a Nationwide Data Platform for Materials Science
Masatoshi Hanai, Ryo Ishikawa, Mitsuaki Kawamura +16
In modern materials science, effective and high-volume data management across leading-edge experimental facilities and world-class supercomputers is indispensable for cutting-edge…
Dynamic hysteresis of an oscillatory contact line
Jiaxing Shen, Yaerim Lee, Yuanzhe Li +3
During oscillatory wetting, a phase retardation emerges between contact angle variation and contact line velocity, presenting as a hysteresis loop in their correlation -- an effect…
Enhancing and Mapping Thermal Boundary Conductance across Bonded Si/SiC Interface
Rulei Guo, Bin Xu, Fengwen Mu +1
SiC is a promising substrate for Si-on-insulator (SOI) wafers for efficient thermal management owing to its high thermal conductivity and large bandgap. However, fabricating a Si d…
Low thermal boundary resistance at bonded GaN/diamond interface by controlling ultrathin heterogeneous amorphous layer
Bin Xu, Fengwen Mu, Yingzhou Liu +3
Thermal boundary resistance (TBR) in semiconductor-on-diamond structure bottlenecks efficient heat dissipation in electronic devices. In this study, to reduce the TBR between GaN a…
Non-equilibrium Magnon Engineering Enabling Significant Thermal Transport Modulation
Takamasa Hirai, Toshiaki Morita, Subrata Biswas +13
Thermal conductivity, a fundamental parameter characterizing thermal transport in solids, is typically determined by electron and phonon transport. Although other transport propert…