2 citations · 2 across the 2 of their papers we have counts for
4 papers
Electron Tunneling Enhances Thermal Conductance through Metal-Insulator-Semiconductor Junctions
Yizhe Liu, Bo Sun
The presence of interfaces in semiconductor devices substantially hinders thermal transport, contributing disproportionately to the overall thermal resistance. However, approaches…
Two-Phase Boiling in a Replaceable Embedded Heat Sink for Ultra-High Heat Flux SiC Chip Cooling
Shasha Huo, Bo Sun
While Moore's Law has approached its physical limits lately, the high integration and miniaturisation of electronics have also brought another thermal failure obstacle. Previous st…
Effective reduction in thermal conductivity by high-density dislocations in SrTiO3
Jinxue Ding, Jiawen Zhang, Jinfeng Dong +5
Decreasing thermal conductivity is important for designing efficient thermoelectric devices. Traditional engineering strategies have focused on point defects and interface design.…
Boundary conditions dictate frequency dependence of thermal conductivity in silicon
Yizhe Liu, Qinshu Li, Fang Liu +2
Non-Fourier thermal transports have drawn significant attention for decades. Among them, the frequency dependent thermal conductivity has been extensively explored by pump-probe te…