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physics.ins-det2025
High Density Hybridisation Using ENIG Bumping and Anisotropic Conductive Films
Haripriya Bangaru, Giovanni Calderini, Dominik Dannheim +5
Fine-pitch hybridisation processes are essential for next-generation pixel detectors and high-density microelectronic assemblies. Conventional bump-bonding techniques, although rel…
physics.ins-det2025
Further Characterisation of Digital Pixel Test Structures Implemented in a 65 nm CMOS Process
Gianluca Aglieri Rinella, Nicole Apadula, Anton Andronic +55
The next generation of MAPS for future tracking detectors will have to meet stringent requirements placed on them. One such detector is the ALICE ITS3 that aims to be very light at…