47 citations · 65 across the 8 of their papers we have counts for
9 papers
High Density Hybridisation Using ENIG Bumping and Anisotropic Conductive Films
Haripriya Bangaru, Giovanni Calderini, Dominik Dannheim +5
Fine-pitch hybridisation processes are essential for next-generation pixel detectors and high-density microelectronic assemblies. Conventional bump-bonding techniques, although rel…
Further Characterisation of Digital Pixel Test Structures Implemented in a 65 nm CMOS Process
Gianluca Aglieri Rinella, Nicole Apadula, Anton Andronic +55
The next generation of MAPS for future tracking detectors will have to meet stringent requirements placed on them. One such detector is the ALICE ITS3 that aims to be very light at…
Laboratory and beam-test performance study of a 55m pitch iLGAD sensor bonded to a Timepix3 readout chip
Peter Svihra, Richard Bates, Justus Braach +5
This contribution reports on characterisation results of a large-area (2) small pitch (55m) inverse Low-Gain Avalanche Detector (iLGAD), bonded to a Timepix3 re…
Pixel detector hybridization and integration with anisotropic conductive adhesives
Alexander Volker, Janis Viktor Schmidt, Dominik Dannheim +10
A reliable and cost-effective interconnect technology is required for the development of hybrid pixel detectors. The interconnect technology needs to be adapted for the pitch and d…
Test-beam Performance Results of the FASTPIX Sub-Nanosecond CMOS Pixel Sensor Demonstrator
Justus Braach, Eric Buschmann, Dominik Dannheim +6
Within the ATTRACT FASTPIX project, a monolithic pixel sensor demonstrator chip has been developed in a modified 180 nm CMOS imaging process technology, targeting sub-nanosecond ti…
Digital Pixel Test Structures implemented in a 65 nm CMOS process
Gianluca Aglieri Rinella, Anton Andronic, Matias Antonelli +49
The ALICE ITS3 (Inner Tracking System 3) upgrade project and the CERN EP R&D on monolithic pixel sensors are investigating the feasibility of the Tower Partners Semiconductor Co. 6…
Pixel detector hybridisation with Anisotropic Conductive Films
J. V. Schmidt, J. Braach, D. Dannheim +3
Hybrid pixel detectors require a reliable and cost-effective interconnect technology adapted to the pitch and die sizes of the respective applications. During the ASIC and sensor R…
Development of novel single-die hybridisation processes for small-pitch pixel detectors
Peter Svihra, Justus Braach, Eric Buschmann +8
Hybrid pixel detectors require a reliable and cost-effective interconnect technology adapted to the pitch and die sizes of the respective applications. During the ASIC and sensor R…
Comparison of different sensor thicknesses and substrate materials for the monolithic small collection-electrode technology demonstrator CLICTD
Katharina Dort, Rafael Ballabriga, Justus Braach +12
Small collection-electrode monolithic CMOS sensors profit from a high signal-to-noise ratio and a small power consumption, but have a limited active sensor volume due to the fabric…