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cond-mat.mtrl-sci2024
Amorphous Boron Nitride as an Ultrathin Copper Diffusion Barrier for Advanced Interconnects
Onurcan Kaya, Hyeongjoon Kim, Byeongkyu Kim +7
This study focuses on amorphous boron nitride (-BN) as a novel diffusion barrier for advanced semiconductor technology, particularly addressing the critical challenge of cop…
cond-mat.mtrl-sci2023
Impact of Hydrogenation on the Stability and Mechanical Properties of Amorphous Boron Nitride
Onurcan Kaya, Luigi Colombo, Aleandro Antidormi +4
Interconnect materials with ultralow dielectric constant, and good thermal and mechanical properties are crucial for the further miniaturization of electronic devices. Recently, it…