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eess.SY2025
3D-ICE 4.0: Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems
Kai Zhu, Darong Huang, Luis Costero +1
The increasing power densities and intricate heat dissipation paths in advanced 2.5D/3D chiplet systems necessitate thermal modeling frameworks that deliver detailed thermal maps w…
eess.SY2025
A 20-Year Retrospective on Power and Thermal Modeling and Management
David Atienza, Kai Zhu, Darong Huang +1
As processor performance advances, increasing power densities and complex thermal behaviors threaten both energy efficiency and system reliability. This survey covers more than two…