activity
20222026
most citedSuperconducting flip-chip devices using indium microspheres on Au-passivated Nb or NbN as under-bump metallization layer

6 citations · 8 across the 6 of their papers we have counts for

collaborators
Showing 2025Show all

2 papers · 1 filter

quant-ph2025

Efficient flip-chip and on-chip-based modulation of flux-tunable superconducting resonators

Achintya Paradkar, Paul Nicaise, Karim Dakroury +5

We demonstrate the efficient modulation of flux-tunable superconducting resonators (FTRs) using flip-chip or on-chip-based input coils. The FTRs we use are aluminum-based quarter-w…

physics.app-ph2025

Modification of adhesion between microparticles and engineered silicon surfaces

Fabian Resare, Somiya Islam Soke, Witlef Wieczorek

A key challenge in performing experiments with microparticles is controlling their adhesion to substrates. For example, levitation of a microparticle initially resting on a surface…