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20222026
most citedSuperconducting flip-chip devices using indium microspheres on Au-passivated Nb or NbN as under-bump metallization layer

6 citations · 8 across the 6 of their papers we have counts for

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cond-mat.supr-con2024★ 6 cited

Superconducting flip-chip devices using indium microspheres on Au-passivated Nb or NbN as under-bump metallization layer

Achintya Paradkar, Paul Nicaise, Karim Dakroury +2

Superconducting flip-chip interconnects are crucial for the three-dimensional integration of superconducting circuits in sensing and quantum technology applications. We demonstrate…